高密度光子封装的晶圆级可插拔光学 I/O 平台博士研究员
Wafer-scale pluggable optical I/O platform for high-density photonic packaging
原帖优先：申请材料、截止时间与资格以原帖和学校官方说明为准。
博士招生与资助公告
- 申请年度
- 2027；原帖说明：How to apply Apply now You need to: • choose programme type (Research), 2027/28, Faculty of Engineering and Physical Sciences • select Full time or Part time • search for programme PhD ORC (7097) • add name of the supervisor in section 2 of the application Applications should include: • your CV (resumé) • 2 academic references • degree transcripts and certificates to date • English language qualification (if applicable)
- 最近申请截止
- 2027-02-02
- 全部申请截止
- （Europe/London）
- 资助原文
- Fees and funding We offer a range of funding opportunities for both UK and international students. Horizon Europe fee waivers automatically cover the difference between overseas and UK fees for qualifying students. Competition-based Presidential Bursaries from the University cover the difference between overseas and UK fees for top-ranked applicants. Competition-based studentships offered by our schools typically cover UK-level tuition fees and a stipend for living costs for top-ranked applicants. Funding will be awarded on a rolling basis, so apply early for the best opportunity to be considered. For more information, please visit our postgraduate research funding pages.
- 资助条件
- 原帖为竞争性或附条件资助说明，未确认本项目获资助及申请人能获奖；不作为保证全奖。
- 原帖材料说明
- • your CV (resumé)
- • 2 academic references
- • degree transcripts and certificates to date
- • English language qualification (if applicable)
确定性信息来自对应版本的完整原帖。原帖只提供日期，日末和学校当地时区为本站转换假设。筛选使用最后申请截止；资助与录取以学校审核结果为准。
AI 中文速览
- 研究内容
- 本项目旨在开发用于低损耗、高密度、可插拔光学接口的代工厂兼容平台，重点解决集成光子学规模化中的光学封装障碍，结合宽带边缘耦合器、被动对准与晶圆级测试，为光互连和光子封装建立可重复的连接。
- 申请条件
- 申请者需持有物理学或紧密相关学科的英国二级甲等（2:1）荣誉学位或其国际同等学历。
- 待遇
- 原文未说明具体薪资金额，但指出提供全面培训（包括光子与光学建模、洁净室设备使用及光学测量与硅光芯片测试等）。
- 申请方式
- 申请人需选择研究型项目类型、2027/28学年、工程与物理科学学院，选择全职或兼职，搜索项目 PhD ORC (7097)，并在申请的第2部分添加导师姓名后在线提交。截止日期为2027年2月2日。
- 材料清单
- 个人简历 (CV)
- 2份学术推荐信
- 迄今为止的学位成绩单与证书
- 英语语言资格证明（如适用）
由 gemini-2.5-flash-lite 生成，博士岗判定置信度 100%。
岗位信息
- 最终轮次截止
- 2027-02-02
- 学科
- 物理与天文
- 合同类型
- 项目资助
- 本站收录
- 内容更新
- 原帖导师候选（待核验）
- Professor Callum Littlejohns, Dr A. Emre Kaplan, Dr Ramsey Selim, Dr Shengqi Yin
- 来源
- 南安普顿大学博士研究项目招生 · 最近核对 2026-10-24
- 详情核验
判定依据（原文摘录）
- 这是一项博士培养机会
Type of degree Doctor of Philosophy
- 项目资助情况（仅限英国）
Funding Fully funded (UK only)
- 入学学历要求
A UK 2:1 honours degree, or its international equivalent, in physics or a closely related discipline.
原文
View all current projects
Postgraduate research project
Wafer-scale pluggable optical I/O platform for high-density photonic packaging
Funding
Fully funded (UK only)
Type of degree
Doctor of Philosophy
Entry requirements
2:1 honours degree
2:1 honours degree
View full entry requirements
Faculty graduate school
Faculty of Engineering and Physical Sciences
Closing date
2 Feb 2027
On this page
About the project
Potential supervisors
Entry requirements
Fees and funding
How to apply
Contact us
About the project
Potential supervisors
Entry requirements
Fees and funding
How to apply
Contact us
About the project
Reliable optical connections are essential to scaling photonic systems. This project will develop a foundry-compatible platform for low-loss, high-density, pluggable optical interfaces. It will combine broadband edge couplers, passive alignment and wafer-level testing to establish repeatable connections for optical interconnects and photonic packaging.
Optical packaging is a critical barrier to scaling integrated photonics. High-density interfaces must provide low coupling loss while accommodating fabrication and assembly tolerances. For pluggable connections, these requirements must also be maintained through repeated attachment and detachment.
This project aims to establish a foundry-compatible optical I/O platform that integrates device design, connector architecture and packaging. The central research question is how optical mode engineering and passive alignment can deliver repeatable, low-loss connections (<1dB per fibre) at high interface density.
The research will develop broadband edge couplers with expanded optical modes and evaluate the trade-offs between coupling efficiency, bandwidth, footprint and alignment tolerance. These designs will be integrated with fibre arrays and expanded-beam interfaces to investigate detachable connector architectures. Optical simulation, fabrication and experimental characterisation will establish the effects of process variation, assembly errors and repeated mating on performance.
Wafer-level optical testing will be investigated alongside packaging methods to support reproducible device screening and assembly. A prototype interface will validate coupling loss, operating bandwidth, alignment tolerance and connection repeatability.
The expected contribution is a set of experimentally validated interface designs and testing methods that provide a route towards scalable photonic packaging. The platform will address optical connectivity requirements in pluggable modules, near-packaged optics and co-packaged optics with collaborating with ORC fiber group.
Comprehensive training will be provided in photonic and optical modelling using Ansys Lumerical, COMSOL Multiphysics and Zemax, alongside full equipment training in the University of Southampton’s cleanroom facilities. You'll also receive hands-on training in optical measurements and silicon photonic chip testing, including optical alignment, fibre-to-chip coupling and device characterisation. Together, these activities will develop the skills required to design, fabricate and experimentally validate integrated photonic devices.
The School of Optoelectronics (ORC) is committed to promoting equality, diversity inclusivity as demonstrated by our Athena SWAN award. We welcome all applicants regardless of their gender, ethnicity, disability, sexual orientation or age, and will give full consideration to applicants seeking flexible working patterns and those who have taken a career break. The University has a generous maternity policy, onsite childcare facilities, and offers a range of benefits to help ensure employees’ well-being and work-life balance. The University of Southampton is committed to sustainability and has been awarded the Platinum EcoAward.
Potential supervisors
Lead supervisor
Professor Callum Littlejohns
PhD
Deputy Director (Cornerstone)
Supervisors
Dr A. Emre Kaplan
Senior Enterprise Fellow
Dr Ramsey Selim
Head of Business Development (Cornerstone)
Dr Shengqi Yin
Enterprise Fellow
Entry requirements
A UK 2:1 honours degree, or its international equivalent, in physics or a closely related discipline.
Fees and funding
We offer a range of funding opportunities for both UK and international students. Horizon Europe fee waivers automatically cover the difference between overseas and UK fees for qualifying students.
Competition-based Presidential Bursaries from the University cover the difference between overseas and UK fees for top-ranked applicants.
Competition-based studentships offered by our schools typically cover UK-level tuition fees and a stipend for living costs for top-ranked applicants.
Funding will be awarded on a rolling basis, so apply early for the best opportunity to be considered.
For more information, please visit our postgraduate research funding pages.
How to apply
Apply now
You need to:
• choose programme type (Research), 2027/28, Faculty of Engineering and Physical Sciences
• select Full time or Part time
• search for programme PhD ORC (7097)
• add name of the supervisor in section 2 of the application
Applications should include:
• your CV (resumé)
• 2 academic references
• degree transcripts and certificates to date
• English language qualification (if applicable)
Contact us
Faculty of Engineering and Physical Sciences
For questions about applying, email our Doctoral College (doctoralcollege-admissions@soton.ac.uk).
Project leader
For an initial conversation, email Professor Callum Littlejohns (C.Littlejohns@soton.ac.uk).